|Product Type||Phone Repair Knives|
|Package Contents||1*Handle, 27*Blades, 1*Plastic Case|
|Dimensions us | metric|
|Product Weight||50 g|
- Dismantle all kinds of small chips
- Remove 6S power IC, all kinds of glass IC
- Disassemble the baseband CPU Wifi module
- CPU upper bleed
- A4-A9 CPU
- Disassemble A8 A9 CPU
- Thickened tin scraper, scrape CPU once, no need to repeat back and forth scraping: thin blade, good toughness.
- When disassembling the chip, first clean the edge glue of the knife position and the vinyl temperature around the chip is 200
- The hot air gun is opened to 150 degrees, and the wind speed at the wind mouth is 60 to preheat the motherboard for 2 minutes
- Change the small head of the hot air gun, turn the temperature to 350 degrees, blow down the position of the knife for 10 seconds, and then shake it from side to side and insert it into the bottom of the chip.
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